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FR 4 High TG PCB Red Soldermask 3 Microinch Gold for System Integration

FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration

    5)FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration

     


    Detailed Product Description

    CCL: SHengyi

    Tg Value: 170C

    Layer Count: 4 Layers

    Copper Weight: 0.5 Oz

    PCB Thickness: 0.4mm +/-0.1

    Solder Mask: Red

    Surface Finish:ENIG

    Via: Via In Pad. Tented


    Advantages

    a) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

    b) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

    c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

    d) No minimum order quantity. 1-10 pieces are offered for sale.


    More Applications in Electronics

    Gateway

    Rfid

    Inverter

    Antenna

    Wifi Booster

    Contract Manufacturing Services

    Low Cost Plc

    Embedded Systems Development

    Embedded Computer Systems

    Ac Power Supplies


    IT-180 Data Sheets (Properties)

    ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS

    IPC-4101C Spec / 99 / 101 / 126

    LAMINATE( IT-180ATC)

    Property

    Thickness<0.50 mm

    Thickness≧0.50 mm

    Units

    Test Method

    [0.0197 in]

    [0.0197 in]

    Typical Value

    Spec

    Typical Value

    Spec

    Metric

    IPC-TM-650

    (English)

    (or as noted)

    Peel Strength, minimum

     

     

     

     

    N/mm

    2.4.8

    A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]

     

     

     

     

    (lb/inch)

    2.4.8.2

    B. Standard profile copper foil

    0.88 (5.0)

    0.70 (4.00)

    0.88 (5.0)

    0.70 (4.00)

     

    2.4.8.3

    1. After Thermal Stress

     

     

     

     

     

     

    2. At 125°C [257 F]

     

     

     

     

     

     

    3. After Process Solutions

    1.23 (7.0)

    0.80 (4.57)

    1.40 (8.0)

    1.05 (6.00)

     

     

     

    1.05 (6.0)

    0.70 (4.00)

    1.23 (7.0)

    0.70 (4.00)

     

     

     

    1.05 (6.0)

    0.55 (3.14)

    1.23 (7.0)

    0.80 (4.57)

     

     

    Volume Resistivity, minimum

     

     

     

     

    MW-cm

    2.5.17.1

    A. C-96/35/90

    3.0x1010

    106

    --

    --

    B. After moisture resistance

    --

    --

    3.0x1010

    104

    C. At elevated temperature E-24/125

    5.0x1010

    103

    1.0x1010

    103

    Surface Resistivity, minimum

     

     

     

     

    MW

    2.5.17.1

    A. C-96/35/90

    3.0x1010

    104

    --

    --

    B. After moisture resistance

    --

    --

    3.0x1010

    104

    C. At elevated temperature E-24/125

    4.0x1010

    103

    4.0x1010

    103

    Moisture Absorption, maximum

    --

    --

    0.12

    0.8

    %

    2.6.2.1

    Dielectric Breakdown, minimum

    --

    --

    60

    40

    kV

    2.5.6

    Permittivity (Dk, 50% resin content)

     

    5.4

     

    5.4

    --

     

    (Laminate & Laminated Prepreg)

     

     

     

    A. 1MHz

    4.4

    4.4

    2.5.5.9

    B. 1GHz

    4.4

    4.4

     

    C. 2GHz

    4.2

    4.3

    2.5.5.13

    D. 5GHz

    4.1

    4.1

     

    E. 10GHz

    4

    4.1

     

    Loss Tangent (Df, 50% resin content)

     

    0.035

     

    0.035

    --

     

    (Laminate & Laminated Prepreg)

     

     

     

    A. 1MHz

    0.015

    0.014

    2.5.5.9

    B. 1GHz

    0.015

    0.015

     

    C. 2GHz

    0.015

    0.015

    2.5.5.13

    D. 5GHz

    0.016

    0.016

     

    E. 10GHz

    0.017

    0.016

     

    Flexural Strength, minimum

     

     

     

     

    N/mm2

    2.4.4

    A. Length direction

    --

    --

    500-530

    415

    (lb/in2)

     

    --

    --

    (72,500-76,850)

    -60,190

     

    B. Cross direction

    --

    --

    410-440

    345

     

     

    --

    --

    (59,450-63,800)

    -50,140

     

    Arc Resistance, minimum

    125

    60

    125

    60

    s

    2.5.1

    Thermal Stress 10 s at 288°C [550.4F],minimum

     

     

     

     

    Rating

    2.4.13.1

    A. Unetched

    Pass

    Pass Visual

    Pass

    Pass Visual

    B. Etched

    Pass

    Pass Visual

    Pass

    Pass Visual

    Electric Strength, minimum

    45

    30

    --

    --

    kV/mm

    2.5.6.2

    (Laminate & Laminated Prepreg)

    Flammability,

    V-0

    V-0

    V-0

    V-0

    Rating

    UL94

    (Laminate & Laminated Prepreg)

    Glass Transition Temperature(DSC)

    175

    170 minimum

    175

    170 minimum

    ˚C

    2.4.25

    Decomposition Temperature

    --

    --

    345

    340 minimum

    ˚C

    2.4.24.6

    (5% wt loss)

    X/Y Axis CTE (40℃ to 125℃)

    --

    --

    10--13

    --

    PPM/˚C

    2.4.24

    Z-Axis CTE

     

     

     

     

     

    2.4.24

    A. Alpha 1

    --

    --

    45

    60 maximum

    PPM/˚C

    B. Alpha 2

    --

    --

    210

    300 maximum

    PPM/˚C

    C. 50 to 260 Degrees C

    --

    --

    2.7

    3.0 maximum

    %

    Thermal Resistance

     

     

     

     

     

    2.4.24.1

    A. T260

    --

    --

    >60

    30 minimum

    Minutes

    B. T288

    --

    --

    >30

    15 minimum

    Minutes

    CAF Resistance

    --

    --

    Pass

    AABUS

    Pass/Fail

    2.6.25

    We are one of the professional fr 4 high tg pcb red soldermask 3 microinch gold for system integration manufacturers and suppliers in China, offering the best services and the highest quality solutions for you. Please rest assured to get the high quality products made in China from our factory.

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