Address: 13G Time Square Center Building, No.102, Center Road, Shajing, Baoan, Shenzhen City, Guangdong Province
FAX : +86-755-23334185
|PCBA Manufacturing solutions|
|PN：||PCBA（RPCBA\FPCBA\R-FPCBA）||Project function type:||\|
|The core base material||Material specification：||FR4/BT、PI|
|The core base material||components||Integrated circuit IC, resistance and capacitance parts|
|PCB size||ODM||Layers||1-30 layers|
|PCB thickness||Min 0.1mm||Min hole||0.2mm|
|Min trace/space||2.5mil||silk technology：||2.5mil|
|Insulation resistance welding：||photosensitive ink/PI cover||Surface treatment||HASL/ENIG/OSP|
|Special packaging：||BGA、COB etc.||Min component||0201|
|Device welding mode||SMT、COB、DIP|
|Substrate manufacturing technology||Materials technology：||
FR4/BT resin, flexible PI polymer material physical properties, mechanical properties, chemical properties should be considered;
Mechanical and electrical properties of FR4 and BT resins, flexible PI polymer materials should be considered.
Manufacturing process of rigid circuit board;
Manufacturing process of flexible circuit board;
Rigid and flexible PCB manufacturing process.
|PCBA Manufacturing technology||Device technology:||
Component brand selection, performance evaluation, environmental storage;
Component replacement support, etc.
Micropackage device mounting (SMT, COB, etc.);
Various substrate devices (SMT, COB, etc.);
Integration of various PCBA manufacturing processes (SMT, COB, plug-in, etc.).
|Hardware electronic technology||Focus on functional logical judgment summary and functional assurance test.Sijia electronic hardware r&d center specializes in RF RF technology, power management technology based IDH module and ESS embedded integration module.|
|Available product design||
Can provide electronic circuit schematic design, PCB wiring design, functional test fixture design;
Can provide manufacturability design, PCB-CAM design.
|Core manufacturing process||Substrate CAM design, drilling compensation, graphic transfer compensation, substrate functional testing, PCBA device selection, PCBA program design|
|Core QC engineering process||Substrate material/device IQC inspection, substrate /PCBA process control evaluation and analysis, PCBA function evaluation and analysis.|
|Finished functional test||
Open short circuit function test of baseboard /PCBA;PCBA module functional logic fixture test;
Substrate /PCBA defect test support.
|Finished product reliability test||
Salt spray test optional;
Thermal shock test, weldability test, virtual welding, device disconnection, etc.
|Product certification||3C certification, UL certification, etc.|
|The product application||Portable terminal equipment, multi-functional integrated parts module, other compressed space electronic equipment, etc. (such as handheld mobile terminals).|