Shenbei Group (HK) Co.,Ltd
Multilayer rigid - flexible PCB manufacturing solutions

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Address: 13G Time Square Center Building, No.102, Center Road, Shajing, Baoan, Shenzhen City, Guangdong Province

TEL: +86-755-23334183

FAX : +86-755-23334185

Email: sales16@shenbeipcb.com

Website: www.shenbeicircuit.com

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Home > Multilayer rigid - flexible PCB manufacturing solutions
Multilayer rigid - flexible PCB manufacturing solutions
PN:Multilayer rigid - flexible PCB Project function type:Device component support carrier
The core base materialMaterial   specification:FR4/BT、PI2W7(5)5$L)L@3YB3FR@KV7N
Auxiliary materialsMaterial   specification:PI\FR4\steel stiffener、Double sided tape
Brand:\PN:\
Size:ODMlayers:2-20layer
Min thickness:0.2mmCNC Min hole:0.2mm
Min trace:3milMin spacing:3mil
Insulation   resistance welding:photosensitive ink、PI coversilk technology:Multicolor   character ink
Special   packaging:BGA、COB,etcSurface treatment:ENIG、Pltaed gold、HASL、OSP etc
stack-upODM
Special technologyMaterials   technology:The substrate material takes into account bending strength, impact strength, water absorption, material density, combustibility, pressure plate melting point, high resistance to chemical change, thermoplastic, resistance to drug, abrasion and dimensional stability;Electrical strength, breakdown voltage, dielectric constant, loss factor, etc.
Manufacturing technology:Special process: blind hole, buried hole, micro hole, cross blind hole, HDI of any order, various surface processes/inks on the same surface, etc.;Special structure: laminated symmetrical/asymmetrical combination of soft and hard, suspended soft plate area, double-layer/three-layer/four-layer/six-layer soft plate structure.
Microelectronics technologyMaterials   technology:Special (substrate, thermosetting ink, photosensitive ink, silver oil, carbon oil, copper paste, stable performance of the coating   adhesive) material;
制造工艺技术:

Part of multi-layer rigid-flexible PCB inner layer shall be embedded with special materials or devices;

Part of the multi-layer rigid-flexible combined circuit board special chip packaging form (BGA, COB,   etc.) before pasting the circuit board special design and manufacture;

Special treatment for high density PCB etching.

Hardware electronicMulti-layer rigid-flexible combined circuit board (MFPC) mostly ACTS as the device component/circuit connection support carrier in the electronic circuit hardware technology environment;A few multilayer rigid-flexible combined circuit boards can be used as LCR devices (such as carbon-oil bridge variable resistor, parallel   plate capacitor, coil inductor, etc.);Part of the multi-layer rigid-flexible circuit board simulation anti-static ESD, anti-interference EMI, resonance, transformer, high-frequency signal transmission circuit.
Available product design

Can provide electronic circuit schematic design, PCB wiring design, functional test fixture design;

Can provide manufacturability design, PCB-CAM design.

Core manufacturing processDrilling/decontamination, lamination, electroplating copper, graphic transfer, molding and other processes.
Core QC engineering procesSubstrate material IQC inspection, drilling decontamination first inspection, pressing first inspection, graphic transfer inspection, molding inspection.
Finished   functional test

Function test of circuit opening and short-circuit;Some products need to test the functional fixture of analog circuit;

Line defect functional test.

Finished   product reliability test

Salt spray test optional;

Thermal shock test, weldability test, etc.

Product   certification3C certification, UL certification, etc.
The product applicationPortable terminal equipment, multi-functional integrated parts module, other compressed space electronic equipment, etc. (such as handheld mobile terminals).