Shenbei Group (HK) Co.,Ltd
Component technology circuit board solution

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Home > Component technology circuit board solution
Component technology circuit board solution
PN:Component   technology PCBProject function type:Simulator component
The core base materialSimulator   componentBT resin、FR4、PI8J`VQA3ZJVJD80[AB)@95@G
Brand:\Type:\
Auxiliary materialsMaterial   specificationAnti-interference material, shielding film, other coating material, other filler material
Brand:\PN:\
Size:ODMlayers:2-12layer
Min thickness:0.2mmMin hole:0.2mm
Min trace:2.5milMin spacing:2.5mil
Insulation   resistance welding:photosensitive ink/PI coversilk technology:Multicolor   character ink
Special   packaging:\Surface   treatment:ENIG、Pltaed gold、HASL、OSP,etc.
Stack-up:ODM
Special technologyMaterials   technology:Substrates often need to consider vertical layer to electrical strength, parallel layer to breakdown voltage, specific frequency point (50HZ\1MHZ\ 13.56mhz \915MHZ\ 2.4ghz \5GHZ\10GHZ) relative dielectric constant and loss factor, insulation resistance and other electrical properties;Water absorption, dimensional stability and other physical and mechanical properties.
Manufacturing technology:Blind hole, buried hole, micro hole, cross blind hole, HDI of any order, various surface processes/inks on the same surface, other coating materials, etc.
Microelectronics technologyMaterials   technology:Special (substrate, thermosetting ink, photosensitive ink, silver oil, carbon oil, copper paste, stable performance of the coating adhesive) material;
Manufacturing technology:

The inner layer of the circuit board shall be embedded with special materials or devices;

Special treatment for high density PCB etching.

Component technologyAnalog resistors and capacitorsCarbon oil coated resistance parts, FPCB process special parallel plate capacitance components.
Analog inductorConventional inductance module, power inductance chip module, etc.
Analog RF RF antennaBluetooth antenna assembly, WIFI antenna assembly, ZIGBEE   antenna assembly, nb-iot antenna assembly, etc.
Simulate other functional modulesCrystal oscillator, transformer, characteristic impedance matching components, etc.
Available product design

Hardware electronic design, electronic circuit schematic design, PCB wiring design, functional test fixture design;

Manufacturability design, PCB-CAM design.

Core manufacturing processCircuit board immersed copper, circuit etching, graphic transfer, characteristic coating material coating, functional testing.
Core QC engineering processCircuit board immersed copper, circuit etching, graphic transfer, characteristic coating material coating, functional testing.
Finished   functional test

Function test of circuit opening and short-circuit;Function fixture test of simulator/analog circuit;

Line defect functional test.

Finished product reliability testSalt spray test optional;Thermal shock test, weldability test, etc.
Product certification3C certification, UL certification, etc.
The product applicationPortable terminal equipment, multi-functional integrated parts module, other compressed space electronic equipment, etc. (such as handheld mobile terminals).