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Home > Card Module
Watch - bracelet M1 card electronic tag module scheme
PN:M1   card electronic label moduleItem   type:Identification   - authentication - payment
Core chip reference:BrandFudan   micro

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PNFM11RF08
Support agreement:ISO/IEC   14443-A
Working frequency:13.56MHz
RF operating mode:Electromagnetic coupling mode
Radio frequency modulation:ASK100%
Module support interface:non-contact
Modules can extend the interface:\
Drive:NO DriveNO Drive
Microprocessor   development\
Safe:

1、Three mutual authentication   processes before reading and writing

2、Each card has a different card sequence number;

3、Data encryption;

4、Pass password and access password protection.

function:Non-contact data and energy transfer (without power   supply);Operating distance not less than 100mm (related to antenna size);Half   duplex communication;The typical processing time is less than   100ms.Communication baud rate: 106Kbit/s.
Application module:M1 electronic tag card, RFID card   reader, settlement system/information system software platform small closed   loop mode breakthrough access control, door lock, membership identification   and payment application
Product form:Independent product formCore chip IDH module form,   SMT/COB mounting mode, flexible circuit board (FPCB) is adopted for the   substrate, and ferrite/resin composite absorbing/amorphous, nanocrystalline   and other anti-interference materials can be attached on the back.
Insert   terminal equipmentSmart watch, wrist band bracelet,   etc.
Common application cases:

For e.g:Spatial compact smart watch, wrist band bracelet terminal non-contact     induction card (campus card) recognition and payment application.

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Product problems:Program planning and product   designScheme planning: it can be   replaced by the chip scheme of sjai electronic partner;Product design: shijia   electronics provides IDH module ODM support.
The   closed loop applicationNon-contact card, non-contact   reader card ISO standards, radio - frequency electrical compatibility   problems are relatively common.
Product   manufacturingIDH module & module must   guarantee the flatness of the substrate and the expansion and contraction of   the structure size.